Patent Assignment
Reel/Frame 052337/0488
Assignment of Assignor's Interest
Recorded: 2020-04-08
Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2020-03-02
CHEN, JIE
Executed: 2020-03-02
CHEN, MING-FA
Executed: 2020-03-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package and Manufacturing Method Thereof