Patent Assignment
Reel/Frame 052350/0629
Assignment of Assignor's Interest
Recorded: 2020-04-08
Pages: 10
Assignors
HSIEH, TIEN-YU
Executed: 2020-04-06
WANG, KUAN-TI
Executed: 2020-04-06
CHEN, HAN-CHEN
Executed: 2020-04-06
LEE, KUN-HSIEN
Executed: 2020-04-06
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same