Patent Assignment
Reel/Frame 052360/0863
Assignment of Assignor's Interest
Recorded: 2020-04-09
Pages: 15
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2019-12-27
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Advanced Copper Interconnects with Hybrid Microstructure
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 30, 2020
From: EDELSTEIN, DANIEL C.; YANG, CHIH-CHAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 052265/0105 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Certificate of Conversion & Change of Name
Sep 7, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 061388/0199 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0410 →