Patent Assignment
Reel/Frame 052374/0283
Assignment of Assignor's Interest
Recorded: 2020-04-12
Pages: 10
Assignors
SU, YAO-CHUN
Executed: 2020-03-31
HSU, CHIH-JUNG
Executed: 2020-03-27
LIN, YI-JOU
Executed: 2020-03-26
PENG, I-HSUAN
Executed: 2020-03-26
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Electronic Package with Rotated Semiconductor Die