Patent Assignment
Reel/Frame 052384/0631
Assignment of Assignor's Interest
Recorded: 2020-04-13
Pages: 6
Assignors
OTANI, TETSUYA
Executed: 2020-01-22
WATANABE, OSAMU
Executed: 2020-01-10
NAKAMURA, TOMONORI
Executed: 2020-01-10
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.