Patent Assignment
Reel/Frame 052388/0356
Assignment of Assignor's Interest
Recorded: 2020-04-14
Pages: 4
Assignor
TERASAKI, NOBUYUKI
Executed: 2020-03-13
Assignee
MITSUBISHI MATERIALS CORPORATION
2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU, TOKYO, 100-8117, JAPAN
Covered Property
(1)
Bonded Body, Insulated Circuit Board with Heat Sink, and Heat Sink