Patent Assignment
Reel/Frame 052417/0027
Assignment of Assignor's Interest
Recorded: 2020-04-16
Pages: 4
Assignors
BAEK, KWANG-HYUN
Executed: 2020-04-14
PARK, SANGWOOK
Executed: 2020-04-14
KAM, DONG GUN
Executed: 2020-04-14
LEE, YOUNG-JU
Executed: 2020-04-14
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
206, WORLD CUP-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16499, KOREA, REPUBLIC OF
Covered Property
(1)
Rf Package Module and Electronic Device Comprising Rf Package Module