RF package module and electronic device comprising RF package module
The disclosure relates to research (No. GK17N0100, millimeter wave 5G mobile communication system development) that was conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017. An Radio Frequency (RF) package module according to various embodiments and an electronic device including the RF package module are provided. The RF package module according to an embodiment includes a sub module including an Radio Frequency Integrated Chip (RFIC); an antenna configured to transmit and receive a signal wirelessly through a predetermined metal pattern; and a multi-layer circuit board including a plurality of layers in which a signal via for transferring the signal between the RFIC and the antenna and one or more ground vias are formed, wherein the antenna is spaced from the one or more ground vias by one or more anti-pads.
1. An RF package module comprising:
a sub module including a Radio Frequency Integrated Chip (RFIC);
an antenna configured to transmit and receive a signal wirelessly through a predetermined metal pattern; and
a multi-layer circuit board including a plurality of layers in which a signal via for transferring the signal between the RFIC and the antenna and one or more ground vias are formed,
wherein the antenna is spaced from the one or more ground vias by one or more anti-pads.
2. The RF package module of claim 1 , wherein the one or more anti-pads are arranged not to overlap each other.
3. The RF package module of claim 1 , wherein a radius of the one or more anti-pads is greater by a predetermined length than a radius of pads of the one or more ground vias.
4. The RF package module of claim 1 , wherein a radius of the one or more anti-pads is determined according to a kind of a dielectric in the multi-layer circuit board.
5. The RF package module of claim 1 , wherein the sub module is connected to one surface of the multi-layer circuit board.
6. The RF package module of claim 5 , wherein the sub module is connected to the multi-layer circuit board through a Ball Grid Array (BGA) process or a Land Grid Array (LGA) process.
7. The RF package module of claim 1 , wherein the antenna includes a patch antenna positioned on one surface of the multi-layer circuit board.
8. The RF package module of claim 1 , wherein the RF package module is configured to radiate a signal in a millimeter band.
9. The RF package module of claim 1 , wherein the signal via includes a through hole via penetrating the plurality of layers of the multi-layer circuit board, and
the one or more anti-pads are formed in an area where the through hole via is connected to the antenna.
10. The RF package module of claim 1 , wherein the one or more ground vias shield the signal via and are spaced by a predetermined distance or more from the signal via.
11. The RF package module of claim 1 , wherein the one or more ground vias surround the signal via.
12. The RF package module of claim 1 , wherein the sub module is a second multi-layer circuit board including the RFIC and a plurality of circuit devices electrically connected to the RFIC.
13. An electronic device comprising:
a sub module including an Radio Frequency Integrated Chip (RFIC);
an antenna configured to transmit and receive a signal wirelessly through a predetermined metal pattern;
a multi-layer circuit board including a plurality of layers in which a signal via for transferring the signal between the RFIC and the antenna and one or more ground vias are formed, wherein the antenna is spaced from the one or more ground vias by one or more anti-pads; and
a baseband module electrically connected to the multi-layer circuit board, and configured to transmit and receive a baseband signal to and from the RFIC and process the baseband signal.