IP Library › Assignment 052417/0966
Patent Assignment
Reel/Frame 052417/0966

Assignment of Assignor's Interest

Recorded: 2020-04-16 Pages: 10
Assignors
ZHANG, WEI
Executed: 2020-02-26
CAO, PENG
Executed: 2020-02-26
XUE, LONGHUI
Executed: 2020-02-26
CAI, JIANCHANG
Executed: 2020-02-26
Assignees
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO.1188 HEZUO RD., (WEST ZONE),, HI-TECH DEVELOPMENT ZONE, CHENGDU, SICHUAN, 611731, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO.10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property (1)
Substrate and Method of Manufacturing the Same, Method of Manufacturing Motherboard, Mask and Evaporation Device
Application: 16/850,472 →
Publication: US 2021/0167025
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 8, 2022
From: BOE TECHNOLOGY GROUP CO., LTD.
To: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Reel/Frame 060747/0089 →