Patent Assignment
Reel/Frame 060747/0089
Assignment of Assignor's Interest
Recorded: 2022-08-08
Pages: 21
Assignor
BOE TECHNOLOGY GROUP CO., LTD.
Executed: 2022-07-26
Assignees
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO.1188 HEZUO RD., (WEST ZONE), HI-TECH DEVELOPMENT ZONE, CHENGDU, SICHUAN, 611731, CHINA
BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
ROOM 407, BUILDING 1, NO.9 DIZE ROAD, BDA, BEIJING, 100176, CHINA
Covered Property
(1)
Substrate and Method of Manufacturing the Same, Method of Manufacturing Motherboard, Mask and Evaporation Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.