Patent Assignment
Reel/Frame 052447/0914
Assignment of Assignor's Interest
Recorded: 2020-04-21
Pages: 5
Assignors
WANG, PO-HAN
Executed: 2020-04-02
KUO, HUNG-JUI
Executed: 2020-04-02
TAI, SHIH-PENG
Executed: 2020-04-06
HU, YU-HSIANG
Executed: 2020-04-02
CHEN, I-CHIA
Executed: 2020-04-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method for Manufacturing the Same