Semiconductor package and method for manufacturing the same

1. A semiconductor package, comprising:

a plurality of semiconductor devices;

an insulating layer, disposed over the plurality of semiconductor devices; and

a redistribution layer, disposed over the insulating layer and electrically connected to the plurality of semiconductor devices, the redistribution layer comprises a conductive line portion;

wherein the semiconductor package has a stitching zone, and the insulating layer has a flat structure and a ridge structure next to the flat structure, wherein the ridge structure is protruded away from the plurality of semiconductor devices relative to the flat structure and positioned within the stitching zone.

2. The semiconductor package according to claim 1 , wherein a height of the ridge structure is from about 0.1 μm to about 1 μm.

3. The semiconductor package according to claim 1 , wherein the ridge structure is in a shape of straight line or L-shape within the semiconductor package.

4. The semiconductor package according to claim 1 , wherein the conductive line portion has a curved section, the curved section extends across and conforms to the ridge structure of the insulating layer.

5. The semiconductor package according to claim 1 , wherein the stitching zone overlaps at least one of the plurality of semiconductor devices.

6. The semiconductor package according to claim 1 , wherein the stitching zone is located at a region between the plurality of semiconductor devices.

7. The semiconductor package according to claim 1 , wherein a width of the semiconductor package is above 33 mm.

8. The semiconductor package according to claim 1 , wherein the insulating layer further comprising a first region and a second region separated by the stitching zone, and difference between an average height of a top surface of the insulating layer in the first region and in the second region is more than 5 μm.

9. The semiconductor package according to claim 1 , wherein the insulating layer further comprising a first region and a second region separated by the stitching zone, and a ratio of a minimum feature size in the first region and the second region is larger than 2.

10. The semiconductor package according to claim 1 , wherein the conductive line portion extends across the stitching zone and comprises a deformed section at the stitching zone, and wherein a width of the deformed section is different from other sections of the conductive line portion.

11. A semiconductor package, comprising:

a semiconductor device;

an insulating layer, disposed over the semiconductor device; and

a redistribution layer, disposed over the insulating layer and electrically connected to the semiconductor device, and the redistribution layer comprising a conductive line portion;

wherein the semiconductor package has a stitching zone, the insulating layer has a flat structure and a ridge structure next to the flat structure, the ridge structure is protruded away from the semiconductor device relative to the flat structure and positioned within the stitching zone, the conductive line portion extends across the stitching zone and comprises a deformed section at the stitching zone on the ridge structure, and a width of the deformed section is different from other sections of the conductive line portion on the flat structure.

12. The semiconductor package according to claim 11 , wherein the conductive line portion further comprises a first section connected with a first end of the deformed section and a second section connected with a second end of the deformed section, wherein the extension lines of the first section and the second section do not coincide.

13. The semiconductor package according to claim 11 , wherein the redistribution layer further comprises an alignment pattern adjacent to the stitching zone of the redistribution layer.

14. A semiconductor package, comprising:

semiconductor devices;

a molding compound disposed between the semiconductor devices; and

a first insulating layer, disposed over the semiconductor devices and the molding compound, the first insulating layer including a first region overlapping the molding compound, a second region overlapping the molding compound and next to the first region, and a third region overlapping one of the semiconductor devices, wherein a top surface of the first insulating layer is leveled higher in the first region than in the second region to form a ridge structure having a width smaller than a gap between the semiconductor devices and the top surface of the insulating layer in the third region is substantially leveled with the top surface of the insulating layer in the second region.

15. The semiconductor package according to claim 14 , wherein the ridge structure extends along a linear path or an L-shape path.

16. The semiconductor package according to claim 14 , wherein the first insulating layer has a thickness thicker in the first region than in the second region.

17. The semiconductor package according to claim 14 , wherein a level difference between the top surface in the first region and the second region is from about 0.1 μm to about 1 μm.

18. The semiconductor package according to claim 14 , wherein the first insulating layer is thicker in the first region than in the second region and the third region.

19. The semiconductor package according to claim 14 , further comprising a second insulating layer disposed over the first insulating layer.

20. The semiconductor package according to claim 19 , wherein a portion of the second insulating layer overlapping the molding compound includes a third region over the first region of the first insulating layer and a fourth region over the second region of the first insulating layer, and a level difference of a top surface of the second insulating layer between the third region and the fourth region is different from a level difference of the top surface of the first insulating layer between the first region and the second region.