Patent Assignment
Reel/Frame 052507/0502
Assignment of Assignor's Interest
Recorded: 2020-04-27
Pages: 27
Assignors
FUKADA, KEISUKE
Executed: 2019-11-22
ISHIBASHI, NAOTO
Executed: 2019-11-22
BANDO, AKIRA
Executed: 2019-11-22
ITO, MASAHIKO
Executed: 2019-11-22
KAMATA, ISAHO
Executed: 2019-11-22
TSUCHIDA, HIDEKAZU
Executed: 2019-11-22
HARA, KAZUKUNI
Executed: 2019-11-22
NAITO, MASAMI
Executed: 2019-11-22
UEHIGASHI, HIDEYUKI
Executed: 2019-11-22
FUJIBAYASHI, HIROAKI
Executed: 2019-11-22
AOKI, HIROFUMI
Executed: 2019-12-18
SUGIURA, TOSHIKAZU
Executed: 2019-11-22
SUZUKI, KATSUMI
Executed: 2019-11-22
Assignees
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
CENTRAL RESEARCH INSTITUTE OF ELECTRIC POWER INDUSTRY
6-1, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8126, JAPAN
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-SHI, AICHI, 448-8661, JAPAN
Covered Property
(1)
Sic Epitaxial Wafer and Method for Producing Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.