Patent Assignment
Reel/Frame 052509/0122
Assignment of Assignor's Interest
Recorded: 2020-04-28
Pages: 6
Assignors
CHO, JAE-HWAN
Executed: 2020-02-21
LEE, SANGHO
Executed: 2020-02-24
HWANG, YOOSANG
Executed: 2020-02-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including Support Pattern and Methods of Fabricating the Same