Semiconductor devices including support pattern and methods of fabricating the same
View Patent ↗Disclosed are semiconductor devices including support patterns and methods of fabricating the same. The semiconductor devices may include a plurality of vertical structures on a substrate and a support pattern that contacts sidewalls of the plurality of vertical structures. The support pattern may include a plurality of support holes extending through the support pattern. The plurality of support holes may include a first support hole and a second support hole that are spaced apart from each other, and the first support hole may have a shape or size different from a shape or size of the second support hole.
1. A semiconductor device comprising:
a plurality of vertical structures on a substrate; and
a support pattern that contacts sidewalls of the plurality of vertical structures,
wherein:
the support pattern includes a plurality of support holes extending through the support pattern,
the plurality of support holes include three first support holes of a first shape or size and three second support holes of a second shape and size that are sequentially and alternatingly arranged around a single support hole at a center of a hexagon,
the first shape or size is different from the second shape or size, and
centers of the three first support holes and the three second support holes overlap, respectively, vertices of the hexagon.
2. The semiconductor device of claim 1 , wherein
when viewed in plan, the support pattern comprises first inner sidewalls that define each first support hole and define a circumference of a circle, and
when viewed in plan, the support pattern comprises second inner sidewalls that define each second support hole and define, respectively, sides of a triangle.
3. The semiconductor device of claim 1 , wherein
when viewed in plan, the support pattern comprises first inner sidewalls that define each first support hole and define a circumference of a first circle,
when viewed in plan, the support pattern comprises second inner sidewalls that define each second support hole and define a circumference of a second circle, and
a diameter of the first circle is different from a diameter of the second circle.
4. The semiconductor device of claim 1 , wherein the sidewall of each of the plurality of vertical structures comprises a portion defining a respective one of the plurality of support holes.
5. The semiconductor device of claim 1 , wherein the plurality of vertical structures comprise three vertical structures that are adjacent to each other, and the three vertical structures define each first support hole or each second support hole.
6. The semiconductor device of claim 1 , wherein the plurality of support holes further include a third support hole,
when viewed in plan, the support pattern comprises first inner sidewalls that define each first support hole and define a circumference of a circle,
when viewed in plan, the support pattern comprises second inner sidewalk that define each second support hole and define, respectively, sides of a first triangle,
when viewed in plan, the support pattern comprises third inner sidewalls that define the third support hole and define, respectively, sides of a second triangle, and
when viewed in plan, the first, second, and third support holes are immediately adjacent to each other and arranged along a first direction, and one of the first support holes is between one of the second support holes and the third support hole.