IP Library › Assignment 052529/0107
Patent Assignment
Reel/Frame 052529/0107

Assignment of Assignor's Interest

Recorded: 2020-04-29 Pages: 4
Assignors
CARNEY, FRANCIS J.
Executed: 2020-04-16
SEDDON, MICHAEL J.
Executed: 2020-04-16
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Multichip Module Supports and Related Methods
Application: 16/862,152 →
Publication: US 2021/0343612
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 27, 2020
From: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 053613/0621 →
Release of Security Interest in Patents Previously Recorded at Reel 053613, Frame 0621 Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0942 →