IP Library › Assignment 064618/0942
Patent Assignment
Reel/Frame 064618/0942

RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 053613, FRAME 0621

Recorded: 2023-08-17 Received: 2023-08-17 Pages: 18
Assignor
Assignees
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, AZ, 85008, UNITED STATES
FAIRCHILD SEMICONDUCTOR CORPORATION
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, AZ, 85008, UNITED STATES
Covered Applications (80)
WIDE BANDGAP WAFER BACKSIDE CAPPED BY POLY-SIC
App. No. 62/705,462
→
SEMICONDUCTOR DEVICE AND METHOD OF FORMING BACKSIDE OPENINGS FOR AN ULTRA-THIN SEMICONDUCTOR DIE
App. No. 16/907,520
→
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
App. No. 16/903,706
→
METHODS AND APPARATUS FOR A BATTERY SYSTEM
App. No. 62/705,201
→
METHODS AND APPARATUS FOR COMPUTING PARASITIC RESISTANCE IN A BATTERY SYSTEM
App. No. 62/705,034
→
ELECTROSTATIC DISCHARGE (ESD) ROBUST TRANSISTORS AND RELATED METHODS
App. No. 16/888,037
→
HIGH-SPEED SUCCESSIVE APPROXIMATION ANALOG-TO-DIGITAL CONVERTER WITH IMPROVED MISMATCH TOLERANCE
App. No. 62/704,788
→
REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS
App. No. 16/886,395
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EMBEDDED IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
App. No. 16/886,325
→
STREAM-BASED POWER ALLOCATION IN MULTI-STREAM TRANSMISSIONS
App. No. 16/883,220
→
ADVANCED DUAL BAND VIRTUAL CONCURRENT FOR WIFI
App. No. 16/882,319
→
DIE SIDEWALL COATINGS AND RELATED METHODS
App. No. 16/879,378
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SEMICONDUCTOR PACKAGES WITH THIN DIE AND RELATED METHODS
App. No. 16/879,251
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BACKMETAL REMOVAL METHODS
App. No. 16/879,429
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IMAGE SENSORS HAVING AN ADJUSTABLE CURRENT SOURCE FOR COLUMN SETTLING SPEEDUP
App. No. 15/929,729
→
IMAGING SYSTEMS AND METHODS FOR PERFORMING FLOATING GATE READOUT VIA DISTRIBUTED PIXEL INTERCONNECTS FOR ANALOG DOMAIN REGIONAL FEATURE EXTRACTION
App. No. 15/929,733
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UNINTERRUPTED CURRENT SENSE
App. No. 15/929,735
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HEAT TRANSFER FOR POWER MODULES
App. No. 15/929,662
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BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE
App. No. 15/931,386
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PRESS-FIT PIN FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
App. No. 15/931,109
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WAFER THINNING SYSTEMS AND RELATED METHODS
App. No. 16/872,971
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POWER DEVICE HAVING SUPER JUNCTION AND SCHOTTKY DIODE
App. No. 16/871,268
→
TRENCH DIODE AND POWER SEMICONDUCTOR DEVICE INCLUDING THE SAME
App. No. 16/871,237
→
STRUCTURE AND METHOD FOR ELECTRONIC DIE SINGULATION USING ALIGNMENT STRUCTURES
App. No. 63/022,957
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DUAL CHANNEL CHIRP IN PARK ASSIST SENSORS
App. No. 62/704,408
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PACKAGE STRUCTURE FOR SEMICONDUCTOR DEVICES
App. No. 15/929,498
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SEMICONDUCTOR SUBSTRATE DIE SAWING SINGULATION SYSTEMS AND METHODS
App. No. 16/867,836
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SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND LIGHT SPREADING LENSES
App. No. 16/868,040
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METHOD OF FORMING A SEMICONDUCTOR DEVICE
App. No. 16/867,218
→
METHOD OF FORMING A SEMICONDUCTOR DEVICE
App. No. 16/867,269
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HYBRID DISTRIBUTED RETRY MECHANISM
App. No. 16/867,343
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DEVICES, SYSTEMS AND PROCESSES FOR IMPROVING FREQUENCY MEASUREMENTS DURING REVERBERATION PERIODS FOR ULTRA-SONIC TRANSDUCERS
App. No. 16/867,298
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POWER MODULE PACKAGE CASING WITH PROTRUSION SUPPORTS
App. No. 16/865,962
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DIE SUPPORT STRUCTURES AND RELATED METHODS
App. No. 16/861,740
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LASER CONTACT ABLATION FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
App. No. 16/862,222
→
TEMPORARY DIE SUPPORT STRUCTURES AND RELATED METHODS
App. No. 16/862,063
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CURVED SEMICONDUCTOR DIE SYSTEMS AND RELATED METHODS
App. No. 16/862,184
→
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS
App. No. 16/861,910
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MULTIDIE SUPPORTS FOR REDUCING DIE WARPAGE
App. No. 16/862,120
→
SEMICONDUCTOR PACKAGES WITH PASSIVATING MATERIAL ON DIE SIDEWALLS AND RELATED METHODS
App. No. 16/862,244
→
MOAT COVERAGE WITH DIELECTRIC FILM FOR DEVICE PASSIVATION AND SINGULATION
App. No. 16/862,015
→
SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS
App. No. 16/862,270
→
MULTICHIP MODULE SUPPORTS AND RELATED METHODS
App. No. 16/862,152
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NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS
App. No. 16/862,294
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SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED METHODS
App. No. 16/861,994
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SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDUCTOR DIE
App. No. 16/861,615
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SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS
App. No. 16/861,810
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IMAGE SENSORS HAVING BOOST CURRENT CONTROL CIRCUITRY FOR COLUMN SETTLING SPEEDUP
App. No. 16/860,220
→
PROCESS VARIATION AS DIE LEVEL TRACEABILITY
App. No. 16/860,683
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SUB-HARMONIC OSCILLATION CONTROL IN PEAK CURRENT LIMIT MODE SWITCHING SYSTEM
App. No. 16/860,804
→
IMAGING SYSTEMS AND METHODS FOR GENERATING HIGH DYNAMIC RANGE IMAGES
App. No. 16/860,327
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SYSTEMS AND METHODS FOR A PHOTOSENSOR
App. No. 63/015,756
→
SYSTEMS AND METHODS FOR A PHOTOSENSOR
App. No. 63/015,762
→
METHOD OF FORMING A SEMICONDUCTOR DEVICE AND CURRENT SENSING CIRCUIT THEREFOR
App. No. 16/857,674
→
WIRELESS ADAPTATION BASED ON MULTIDIMENSIONAL INPUT
App. No. 16/856,351
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ENHANCED RANGE-VELOCITY FINDING IN FREQUENCY-MODULATED CONTINUOUS WAVE RADAR
App. No. 16/857,102
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ADAPTIVE SPATIAL DIAGNOSTICS IN A WIRELESS NETWORK
App. No. 16/857,052
→
TRANSMITTING POWER STAGE PARAMETERS FROM A VOLTAGE REGULATOR TO POWER STAGES
App. No. 16/855,120
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IMAGING SYSTEMS AND METHODS FOR PERFORMING PIXEL BINNING AND VARIABLE INTEGRATION FOR ANALOG DOMAIN REGIONAL FEATURE EXTRACTION
App. No. 16/854,057
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SEMICONDUCTOR DEVICE HAVING A PROGRAMMING ELEMENT
App. No. 16/853,613
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SYSTEMS AND METHODS OF ADJUSTING SLOPE COMPENSATION
App. No. 16/852,766
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METHODS AND APPARATUS FOR A BATTERY
App. No. 16/853,063
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SEMICONDUCTOR PACKAGE AND RELATED METHODS
App. No. 16/853,073
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SEMICONDUCTOR WAFER THINNING SYSTEMS AND RELATED METHODS
App. No. 16/852,146
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BATTERY CHARGE TERMINATION VOLTAGE REDUCTION
App. No. 16/850,456
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KICKBACK-LIMITED SOFT-SHUTDOWN CIRCUIT FOR A COIL
App. No. 16/848,033
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METHODS AND APPARATUS FOR DRIVER CALIBRATION
App. No. 16/848,240
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ELECTROSTATIC DISCHARGE HANDLING FOR LATERAL TRANSISTOR DEVICES
App. No. 16/848,637
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METHODS AND APPARATUS FOR A BATTERY
App. No. 16/846,622
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Electronic Device Including a Transistor and a Shield Electrode
App. No. 16/847,152
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HEATSINK FOR THERMAL RESPONSE CONTROL FOR INTEGRATED CIRCUITS
App. No. 16/846,778
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ELECTRONIC DEVICE INCLUDING A TRANSISTOR HAVING STRUCTURES WITH DIFFERENT CHARACTERISTICS
App. No. 16/847,013
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CIRCUIT AND METHOD TO DETECT DEFECTS IN A POWER SWITCHING DEVICE
App. No. 16/845,860
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PASSIVE TUNABLE INTEGRATED CIRCUIT WITH ELECTRO-STATIC DISCHARGE PROTECTION
App. No. 16/844,102
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RADIO FREQUENCY SWITCH
App. No. 16/844,149
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AMPLIFIER WITH ADAPTIVELY-CONTROLLED LOCAL FEEDBACK LOOP
App. No. 16/843,675
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CIRCUIT AND METHOD FOR COIL CURRENT CONTROL
App. No. 16/843,225
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REMOTE CONTACTS FOR A TRENCH SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
App. No. 16/841,167
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HYBRID CONTROL OF SWITCHING POWER CONVERTERS
App. No. 16/839,185
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SENSOR-LESS CIRCUITS AND RELATED METHODS FOR BACK EMF ZERO CROSSING DETECTION
App. No. 16/837,575
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