Heat transfer for power modules
In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus includes a cover defining a channel where the channel is outside of the module and the plurality of protrusions of the heatsink are disposed within the channel, and a sealing mechanism is disposed between the cover and the module is in contact with the module.
1. An apparatus, comprising:
a module including a semiconductor die;
a heatsink coupled to the module and including:
a substrate, and
a plurality of protrusions;
a cover defining a channel, the channel being outside of the module, the plurality of protrusions of the heatsink being disposed within the channel, the cover being disposed around a side portion and a top portion of the plurality of protrusions, at least a portion of the module being exposed outside of the cover; and
a sealing mechanism disposed between the cover and the module and in contact with the module.
2. The apparatus of claim 1 , wherein the cover includes an inlet opening and an outlet opening in fluid communication with the inlet opening via the channel.
3. The apparatus of claim 1 , wherein the channel is a first channel, the cover is a first cover including the first channel, the heatsink is a first heatsink, the first cover and the first heatsink are on a first side of the module,
the apparatus, further comprising:
a second heatsink coupled to a second side of the module; and
a second cover including a second channel, the second heatsink being disposed within the second channel.
4. The apparatus of claim 3 , wherein the first cover is coupled to the second cover via a coupling mechanism disposed lateral to the module.
5. The apparatus of claim 1 , wherein the module is a first module, the heatsink is a first heatsink,
the apparatus further comprising:
a second module; and
a second heatsink coupled to the second module, the second heatsink having a plurality of protrusions within the channel, the first heatsink and the second heatsink being aligned along the channel.
6. The apparatus of claim 1 , wherein the plurality of protrusions including at least one protrusion having an end separated from an inner surface of the channel by a gap.
7. The apparatus of claim 1 , wherein the sealing mechanism is in contact with the substrate of the heatsink.
8. The apparatus of claim 1 , further comprising:
a coupling mechanism coupling the cover to the substrate of the heatsink.
9. The apparatus of claim 8 , wherein the coupling mechanism is at least one of screw, a rivet, a clasp, a latch, an anchor, a spring, a press-fit mechanism, or a glue.
10. The apparatus of claim 1 , wherein the sealing mechanism is in contact with at least a portion of the module.
11. The apparatus of claim 1 , wherein the sealing mechanism includes an o-ring disposed within a groove included in the cover.
12. The apparatus of claim 1 , wherein the module is aligned along a first plane, the sealing mechanism is aligned along a second plane, the sealing mechanism is disposed along a perimeter of the module.
13. The apparatus of claim 1 , wherein the heatsink includes a first metal and a second metal.
14. The apparatus of claim 1 , wherein the module is a dual-sided module including a direct bonded metal substrate.
15. The apparatus of claim 1 , wherein the module includes a direct bonded metal substrate in contact with the semiconductor die, the direct bonded metal substrate includes a dielectric layer disposed between a pair of metal layers.
16. The apparatus of claim 1 , wherein the sealing mechanism includes a sealant.
17. An apparatus, comprising:
a module including a semiconductor die;
a cover including:
a channel being in fluid communication with an outside surface of the module, and
a plurality of protrusions extending from an inner surface of the cover into the channel; and
a sealing mechanism disposed between the cover and the module and in contact with the module, at least a portion of the module being exposed outside of the cover.
18. The apparatus of claim 17 , wherein an end of at least one of the plurality of protrusions is separated from a surface of the module by a gap.
19. The apparatus of claim 17 , wherein the cover includes an inlet opening and an outlet opening in fluid communication with the inlet opening via the channel.
20. The apparatus of claim 17 , wherein the cover includes an inlet opening and an outlet opening in fluid communication with the inlet opening via the channel, the module is a first module,
the apparatus, further comprising:
a second module, the first module and the second module being aligned along the channel between the inlet opening and the outlet opening.
21. An apparatus comprising:
a semiconductor die encapsulated in a molding material within a module;
a lead coupled to the module;
a direct bonded metal substrate having an inner surface electrically coupled to the semiconductor die; and
a cover around at least a portion of the module such that a heat-transfer mechanism is disposed within a channel of the cover between a wall of the cover and the module and such that at least a portion of the module is exposed outside of the cover, the channel being disposed outside of the module, the lead extending from the portion of the module exposed outside of the cover.
22. The apparatus of claim 21 , wherein the heat-transfer mechanism is a heatsink coupled to the cover or the module before the cover is coupled around the module.
23. The apparatus of claim 21 , wherein the heat-transfer mechanism includes a cover protrusion extending from the cover.