Patent Assignment
Reel/Frame 053613/0621
SECURITY INTEREST
Recorded: 2020-08-27
Received: 2020-08-27
Pages: 16
Assignors
FAIRCHILD SEMICONDUCTOR CORPORATION
Executed: 2020-08-10
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Executed: 2020-08-10
Assignee
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
60 WALL STREET, NEW YORK, NY, 10005, UNITED STATES
Covered Applications
(80)
WIDE BANDGAP WAFER BACKSIDE CAPPED BY POLY-SIC
App. No. 62/705,462
→
SEMICONDUCTOR DEVICE AND METHOD OF FORMING BACKSIDE OPENINGS FOR AN ULTRA-THIN SEMICONDUCTOR DIE
App. No. 16/907,520
→
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
App. No. 16/903,706
→
METHODS AND APPARATUS FOR A BATTERY SYSTEM
App. No. 62/705,201
→
METHODS AND APPARATUS FOR COMPUTING PARASITIC RESISTANCE IN A BATTERY SYSTEM
App. No. 62/705,034
→
ELECTROSTATIC DISCHARGE (ESD) ROBUST TRANSISTORS AND RELATED METHODS
App. No. 16/888,037
→
HIGH-SPEED SUCCESSIVE APPROXIMATION ANALOG-TO-DIGITAL CONVERTER WITH IMPROVED MISMATCH TOLERANCE
App. No. 62/704,788
→
REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS
App. No. 16/886,395
→
EMBEDDED IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
App. No. 16/886,325
→
STREAM-BASED POWER ALLOCATION IN MULTI-STREAM TRANSMISSIONS
App. No. 16/883,220
→
ADVANCED DUAL BAND VIRTUAL CONCURRENT FOR WIFI
App. No. 16/882,319
→
DIE SIDEWALL COATINGS AND RELATED METHODS
App. No. 16/879,378
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SEMICONDUCTOR PACKAGES WITH THIN DIE AND RELATED METHODS
App. No. 16/879,251
→
BACKMETAL REMOVAL METHODS
App. No. 16/879,429
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IMAGE SENSORS HAVING AN ADJUSTABLE CURRENT SOURCE FOR COLUMN SETTLING SPEEDUP
App. No. 15/929,729
→
IMAGING SYSTEMS AND METHODS FOR PERFORMING FLOATING GATE READOUT VIA DISTRIBUTED PIXEL INTERCONNECTS FOR ANALOG DOMAIN REGIONAL FEATURE EXTRACTION
App. No. 15/929,733
→
UNINTERRUPTED CURRENT SENSE
App. No. 15/929,735
→
HEAT TRANSFER FOR POWER MODULES
App. No. 15/929,662
→
BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE
App. No. 15/931,386
→
PRESS-FIT PIN FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
App. No. 15/931,109
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WAFER THINNING SYSTEMS AND RELATED METHODS
App. No. 16/872,971
→
POWER DEVICE HAVING SUPER JUNCTION AND SCHOTTKY DIODE
App. No. 16/871,268
→
TRENCH DIODE AND POWER SEMICONDUCTOR DEVICE INCLUDING THE SAME
App. No. 16/871,237
→
STRUCTURE AND METHOD FOR ELECTRONIC DIE SINGULATION USING ALIGNMENT STRUCTURES
App. No. 63/022,957
→
DUAL CHANNEL CHIRP IN PARK ASSIST SENSORS
App. No. 62/704,408
→
PACKAGE STRUCTURE FOR SEMICONDUCTOR DEVICES
App. No. 15/929,498
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SEMICONDUCTOR SUBSTRATE DIE SAWING SINGULATION SYSTEMS AND METHODS
App. No. 16/867,836
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SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND LIGHT SPREADING LENSES
App. No. 16/868,040
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METHOD OF FORMING A SEMICONDUCTOR DEVICE
App. No. 16/867,218
→
METHOD OF FORMING A SEMICONDUCTOR DEVICE
App. No. 16/867,269
→
HYBRID DISTRIBUTED RETRY MECHANISM
App. No. 16/867,343
→
DEVICES, SYSTEMS AND PROCESSES FOR IMPROVING FREQUENCY MEASUREMENTS DURING REVERBERATION PERIODS FOR ULTRA-SONIC TRANSDUCERS
App. No. 16/867,298
→
POWER MODULE PACKAGE CASING WITH PROTRUSION SUPPORTS
App. No. 16/865,962
→
DIE SUPPORT STRUCTURES AND RELATED METHODS
App. No. 16/861,740
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LASER CONTACT ABLATION FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
App. No. 16/862,222
→
TEMPORARY DIE SUPPORT STRUCTURES AND RELATED METHODS
App. No. 16/862,063
→
CURVED SEMICONDUCTOR DIE SYSTEMS AND RELATED METHODS
App. No. 16/862,184
→
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS
App. No. 16/861,910
→
MULTIDIE SUPPORTS FOR REDUCING DIE WARPAGE
App. No. 16/862,120
→
SEMICONDUCTOR PACKAGES WITH PASSIVATING MATERIAL ON DIE SIDEWALLS AND RELATED METHODS
App. No. 16/862,244
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MOAT COVERAGE WITH DIELECTRIC FILM FOR DEVICE PASSIVATION AND SINGULATION
App. No. 16/862,015
→
SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS
App. No. 16/862,270
→
MULTICHIP MODULE SUPPORTS AND RELATED METHODS
App. No. 16/862,152
→
NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS
App. No. 16/862,294
→
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED METHODS
App. No. 16/861,994
→
SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDUCTOR DIE
App. No. 16/861,615
→
SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS
App. No. 16/861,810
→
IMAGE SENSORS HAVING BOOST CURRENT CONTROL CIRCUITRY FOR COLUMN SETTLING SPEEDUP
App. No. 16/860,220
→
PROCESS VARIATION AS DIE LEVEL TRACEABILITY
App. No. 16/860,683
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SUB-HARMONIC OSCILLATION CONTROL IN PEAK CURRENT LIMIT MODE SWITCHING SYSTEM
App. No. 16/860,804
→
IMAGING SYSTEMS AND METHODS FOR GENERATING HIGH DYNAMIC RANGE IMAGES
App. No. 16/860,327
→
SYSTEMS AND METHODS FOR A PHOTOSENSOR
App. No. 63/015,756
→
SYSTEMS AND METHODS FOR A PHOTOSENSOR
App. No. 63/015,762
→
METHOD OF FORMING A SEMICONDUCTOR DEVICE AND CURRENT SENSING CIRCUIT THEREFOR
App. No. 16/857,674
→
WIRELESS ADAPTATION BASED ON MULTIDIMENSIONAL INPUT
App. No. 16/856,351
→
ENHANCED RANGE-VELOCITY FINDING IN FREQUENCY-MODULATED CONTINUOUS WAVE RADAR
App. No. 16/857,102
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ADAPTIVE SPATIAL DIAGNOSTICS IN A WIRELESS NETWORK
App. No. 16/857,052
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TRANSMITTING POWER STAGE PARAMETERS FROM A VOLTAGE REGULATOR TO POWER STAGES
App. No. 16/855,120
→
IMAGING SYSTEMS AND METHODS FOR PERFORMING PIXEL BINNING AND VARIABLE INTEGRATION FOR ANALOG DOMAIN REGIONAL FEATURE EXTRACTION
App. No. 16/854,057
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SEMICONDUCTOR DEVICE HAVING A PROGRAMMING ELEMENT
App. No. 16/853,613
→
SYSTEMS AND METHODS OF ADJUSTING SLOPE COMPENSATION
App. No. 16/852,766
→
METHODS AND APPARATUS FOR A BATTERY
App. No. 16/853,063
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SEMICONDUCTOR PACKAGE AND RELATED METHODS
App. No. 16/853,073
→
SEMICONDUCTOR WAFER THINNING SYSTEMS AND RELATED METHODS
App. No. 16/852,146
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BATTERY CHARGE TERMINATION VOLTAGE REDUCTION
App. No. 16/850,456
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KICKBACK-LIMITED SOFT-SHUTDOWN CIRCUIT FOR A COIL
App. No. 16/848,033
→
METHODS AND APPARATUS FOR DRIVER CALIBRATION
App. No. 16/848,240
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ELECTROSTATIC DISCHARGE HANDLING FOR LATERAL TRANSISTOR DEVICES
App. No. 16/848,637
→
METHODS AND APPARATUS FOR A BATTERY
App. No. 16/846,622
→
Electronic Device Including a Transistor and a Shield Electrode
App. No. 16/847,152
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HEATSINK FOR THERMAL RESPONSE CONTROL FOR INTEGRATED CIRCUITS
App. No. 16/846,778
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ELECTRONIC DEVICE INCLUDING A TRANSISTOR HAVING STRUCTURES WITH DIFFERENT CHARACTERISTICS
App. No. 16/847,013
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CIRCUIT AND METHOD TO DETECT DEFECTS IN A POWER SWITCHING DEVICE
App. No. 16/845,860
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PASSIVE TUNABLE INTEGRATED CIRCUIT WITH ELECTRO-STATIC DISCHARGE PROTECTION
App. No. 16/844,102
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RADIO FREQUENCY SWITCH
App. No. 16/844,149
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AMPLIFIER WITH ADAPTIVELY-CONTROLLED LOCAL FEEDBACK LOOP
App. No. 16/843,675
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CIRCUIT AND METHOD FOR COIL CURRENT CONTROL
App. No. 16/843,225
→
REMOTE CONTACTS FOR A TRENCH SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
App. No. 16/841,167
→
HYBRID CONTROL OF SWITCHING POWER CONVERTERS
App. No. 16/839,185
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SENSOR-LESS CIRCUITS AND RELATED METHODS FOR BACK EMF ZERO CROSSING DETECTION
App. No. 16/837,575
→