IP Library Granted Patent US 11,626,677
Granted Patent B2
US 11,626,677 · App. 15/931,386 · Granted Apr 11, 2023

Bonding module pins to an electronic substrate

Inventors: Erik Nino Mercado Tolentino (Negeri Sembilan, MY); Dennis Cadiz Yborde (Digos, PH); Shutesh Krishnan (Negeri Sembilan, MY); Pui Leng Low (Rantau, MY)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H01R12/73H01L23/49827H01L23/49894
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Quick Facts
Patent No.
US 11,626,677
App. No.
15/931,386
Granted
Apr 11, 2023
Kind
B2
Abstract

A method includes disposing a terminal pin on an electronic substrate with a base region of the terminal pin in contact with a circuit trace on an electronic substrate, and ultrasonically coupling the base region of the terminal pin to the circuit trace.

Claims (25)

1. A terminal pin comprising:

a body region including a body having a length between a first end and a second end and a body width perpendicular to the length, the body being a cylindrical body including at least one shape feature that is compressible in a direction perpendicular to the length of the cylindrical body, the at least one shape feature including at least a groove disposed around the cylindrical body;

a tip region extending from the first end of the body along the length; and

a base region extending from the second end of the body along the length,

the base region including a flange having a flange width that is greater than the body width perpendicular to the length, the flange having a flat surface configured to be placed on a metal pad and configured to receive ultrasound energy to weld the base region to the metal pad,

the terminal pin configured to be received in a lumen of a probe tip of an ultrasonic welding device such that an end face of the probe tip is flush with the flange.

2. The terminal pin of claim 1 , wherein the body is disposed in a lumen of a probe tip of an ultrasonic welding device with an end face of the probe tip flush with the flange.

3. The terminal pin of claim 2 , wherein the flange is disposed on, and ultrasonically welded to, an electronic substrate.

4. The terminal pin of claim 2 , wherein the at least one shape feature includes an eye-of-needle structure disposed in the tip region of the terminal pin.

5. The terminal pin of claim 2 , wherein the at least one shape feature includes a chamfer transitioning from the body to the flange in the base region.

6. The terminal pin of claim 2 , wherein the body region includes a flat ribbon-like body, and wherein the at least one shape feature includes a chamfer transitioning from at least one lateral side of the flat ribbon-like body to the flange in the base region.

7. The terminal pin of claim 2 , wherein the at least one shape feature when compressed has a reduced diameter or width allowing the terminal pin to be inserted in the lumen of the ultrasonic welding device without resistance.

8. The terminal pin of claim 2 , wherein the at least one shape feature includes an eye-of-needle structure disposed in the body region of the terminal pin, the eye-of-needle structure having a width greater than a diameter of the lumen of the ultrasonic device.

9. The terminal pin of claim 2 , wherein the at least one shape feature includes a chamfer transitioning from the body of the terminal pin to the flange, the chamfer having a diameter greater than a diameter of the lumen of the ultrasonic device.

10. The terminal pin of claim 1 , wherein the body region includes a rod-like cylindrical body having a diameter in a range of about 0.4 mm millimeters to 2 millimeters.

11. The terminal pin of claim 10 , wherein the tip region includes an extension of the rod-like cylindrical body with a pointed end.

12. The terminal pin of claim 11 , wherein the extension of the rod-like cylindrical body in the tip region includes a grooves-and-ridges section having at least one circumferential groove and ridge.

13. The terminal pin of claim 1 , wherein the flange is one of a circular plate, an oval plate, or a rectangular plate.

14. The terminal pin of claim 13 , wherein the flange is one of the circular plate or the oval plate and has a diameter in a range of about 0.4 millimeters to 2.0 millimeters.

15. The terminal pin of claim 13 , wherein a chamfer transitions from the body to the flange at an angle in a range of about 20 degrees to 70 degrees.

16. The terminal pin of claim 15 , wherein the chamfer has a diameter at the flange that is greater than a diameter of the body by about 0.2 millimeters to 0.6 millimeters.

17. The terminal pin of claim 1 , wherein the tip region includes an eye-of-needle structure formed by providing a circular or oval hole in a flattened extension of a cylindrical body of the body region.

18. The terminal pin of claim 17 , wherein the eye-of-needle structure has a lateral width at its widest in a range of about 0.8 millimeters to 3.0 millimeters.

19. The terminal pin of claim 1 , wherein the body region includes structures of non-cylindrical shape including at least one of an S-shaped ribbon structure, a flat ribbon-like structure, or a double-eyelet eye-of-needle structure.

20. The terminal pin of claim 19 wherein the tip region includes an eye-of-needle structure formed by providing a circular or oval hole in an extension of a flat ribbon-like structure of the body region.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 053613, FRAME 0621 Recorded Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0942 →
SECURITY INTEREST Recorded Aug 27, 2020
From: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 053613/0621 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2020
From: TOLENTINO, ERIK NINO MERCADO; YBORDE, DENNIS CADIZ; KRISHNAN, SHUTESH; LOW, PUI LENG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 052654/0033 →
Continuity (1)
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