IP Library Assignment 052534/0545
Patent Assignment
Reel/Frame 052534/0545

Assignment of Assignor's Interest

Recorded: 2020-04-30 Pages: 3
Assignors
JUAN, YI-CHENG
Executed: 2020-04-24
CHEN, HAN-HSING
Executed: 2020-04-24
Assignee
KINGPAK TECHNOLOGY INC.
NO.84, TAI-HO RD., CHU-PEI,, HSIN-CHU COUNTY, 302, TAIWAN
Covered Property (1)
Defect Inspection Method for Sensor Package Structure
Application: 16/862,731 →
Publication: US 2021/0150689
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Dec 14, 2022
From: KINGPAK TECHNOLOGY INC.
To: TONG HSING ELECTRONIC INDUSTRIES, LTD.
Reel/Frame 062119/0661 →