IP Library Assignment 052560/0488
Patent Assignment
Reel/Frame 052560/0488

Assignment of Assignor's Interest

Recorded: 2020-05-04 Pages: 9
Assignors
KIM, BYEONGSANG
Executed: 2020-04-13
KIM, KEONWOO
Executed: 2020-04-13
KIM, EUNGSU
Executed: 2020-04-13
KIM, HAKYOUNG
Executed: 2020-04-13
MIN, HEEWON
Executed: 2020-04-13
BANG, KYEONGTEA
Executed: 2020-04-13
SHIN, SEUNGWON
Executed: 2020-04-13
YEO, DONGYUN
Executed: 2020-04-13
LEE, HYANJUNG
Executed: 2020-04-13
JEONG, KYEONGSEOK
Executed: 2020-04-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Electrostatic Chuck and Substrate Processing Apparatus Including the Same
Application: 16/865,493 →
Publication: US 2021/0111007