IP Library › Assignment 052561/0717
Patent Assignment
Reel/Frame 052561/0717

Assignment of Assignor's Interest

Recorded: 2020-05-04 Pages: 8
Assignors
SHIN, KEUNWOOK
Executed: 2020-04-29
SHIN, HYEONJIN
Executed: 2020-04-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Interconnect Structure Including Graphene-Metal Barrier and Method of Manufacturing the Same
Application: 16/861,891 →
Publication: US 2020/0350252
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 4, 2020
From: KIM, KIBUM; KIM, HYUNMI; LEE, SANGHUN
To: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
Reel/Frame 052561/0738 →