Patent Assignment
Reel/Frame 052561/0893
Assignment of Assignor's Interest
Recorded: 2020-05-04
Pages: 4
Assignors
SUNG, CHIH WEI
Executed: 2020-03-06
TSENG, CHUNG-BIN
Executed: 2020-03-06
LIAO, KENG-YING
Executed: 2020-03-06
WU, YEN-JOU
Executed: 2020-03-06
CHEN, PO-ZEN
Executed: 2020-03-16
YEH, SU-YU
Executed: 2020-03-31
SU, CHING-CHUNG
Executed: 2020-03-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bsi Chip with Backside Alignment Mark