Patent Assignment
Reel/Frame 052576/0630
Assignment of Assignor's Interest
Recorded: 2020-05-05
Pages: 2
Assignors
MINAMI, HISATAKA
Executed: 2016-07-06
IWANO, TOMOHIRO
Executed: 2016-06-27
AKUTSU, TOSHIAKI
Executed: 2016-06-27
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Abrasive, Abrasive Set, and Method for Polishing Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →