Patent Assignment
Reel/Frame 052584/0391
Assignment of Assignor's Interest
Recorded: 2020-05-06
Pages: 8
Assignors
WEALE, GARETH PRYCE
Executed: 2020-05-04
STEFFLER, JOSEPH
Executed: 2020-05-04
TAN, YIK YEE
Executed: 2020-05-05
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Package Structure for Semiconductor Devices
Patent:
11,049,792 →
Application:
15/929,498 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 27, 2020
From: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 053613/0621 →
Release of Security Interest in Patents Previously Recorded at Reel 053613, Frame 0621
Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0942 →