Patent Assignment
Reel/Frame 052603/0212
Assignment of Assignor's Interest
Recorded: 2020-05-07
Pages: 3
Assignors
WAN, ZHIMIN
Executed: 2020-02-04
CHIU, CHIA-PIN
Executed: 2020-02-04
JHA, CHANDRA MOHAN
Executed: 2020-02-04
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Heatsink Cutout and Insulating Through Silicon Vias to Cut Thermal Cross-Talk