Heatsink cutout and insulating through silicon vias to cut thermal cross-talk
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises an interposer, a first die attached to the interposer, and a second die attached to the interposer. In an embodiment, the electronic package further comprises a heatsink thermally coupled to the first die and the second die. In an embodiment, the heatsink has a first surface facing away from the first die and the second die and a second surface facing the first die and the second die. In an embodiment, the heatsink comprises a thermal break between the first die and the second die.
1. An electronic package, comprising:
an interposer;
a first die attached to the interposer;
a second die attached to the interposer; and
a heatsink thermally coupled to the first die and the second die, wherein the heatsink has a first surface facing away from the first die and the second die and a second surface facing the first die and the second die, and wherein the heatsink comprises:
a thermal break vertically overlapping with a space between the first die and the second die, the space having a lateral width greater than a lateral width of the thermal break.
2. The electronic package of claim 1 , wherein the thermal break comprises a trench into the heatsink.
3. The electronic package of claim 2 , wherein the trench is disposed into the first surface.
4. The electronic package of claim 2 , wherein the trench is disposed into the second surface.
5. The electronic package of claim 2 , wherein the trench passes through an entire thickness of the heatsink.
6. The electronic package of claim 1 , wherein the thermal break comprises a plurality of trenches, wherein the plurality of trenches comprises a first trench and a second trench.
7. The electronic package of claim 6 , wherein the first trench and the second trench are both disposed into the first surface of the heatsink, or wherein the first trench and the second trench are both disposed into the second surface.
8. The electronic package of claim 6 , wherein the first trench is disposed into the first surface, and the second trench is disposed into the second surface.
9. The electronic package of claim 1 , wherein the thermal break comprises a plurality of holes disposed into the heatsink.
10. The electronic package of claim 1 , wherein the interposer is embedded in a package substrate.
11. An electronic package, comprising:
an interposer with a first surface and a second surface opposite from the first surface;
a first die attached to the first surface of the interposer; and
a second die attached to the first surface of the interposer, wherein the first die is communicatively coupled to the second die by a trace on the interposer, and wherein the interposer comprises a thermal break vertically overlapping with a space between the first die and the second die, the space having a lateral width greater than a lateral width of the thermal break.
12. The electronic package of claim 11 , wherein the thermal break comprises:
a trench into the interposer.
13. The electronic package of claim 12 , wherein the trench is disposed into the first surface or into the second surface.
14. The electronic package of claim 12 , wherein the trench passes through an entire thickness of the interposer.
15. The electronic package of claim 12 , wherein the trench is at least partially filled with a fill material, wherein the fill material is a thermally insulating material.
16. The electronic package of claim 11 , wherein the thermal break comprises a plurality of trenches, wherein the plurality of trenches comprises a first trench and a second trench.
17. The electronic package of claim 11 , wherein the thermal break comprises a plurality of holes into the interposer, and wherein the trace passes between a pair of holes of the plurality of holes.
18. The electronic package of claim 11 , wherein the interposer is embedded in a package substrate.
19. An electronic package, comprising:
a first die;
a second die laterally adjacent to the first die;
an interposer, wherein the first die and the second die are over the interposer; and
a heatsink over the first die and the second die, wherein the interposer or the heatsink, or the interposer and the heatsink, comprise:
a trench, wherein the trench is vertically overlapping with a space between a first edge of the first die and a second edge of the second die, the space having a lateral width greater than a lateral width of the trench.
20. The electronic package of claim 19 , wherein the first die is a processor die, and wherein the second die is a high bandwidth memory (HBM) module.
21. The electronic package of claim 19 , wherein the interposer is embedded in a package substrate, and wherein the first die and the second die are both over the package substrate.
22. The electronic package of claim 19 , wherein the interposer is attached to a package substrate, wherein the interposer is between the first die and a surface of the package substrate.
23. An electronic system, comprising:
a board;
a package substrate attached to the board;
an interposer attached to the package substrate;
a first die over the interposer;
a second die over the interposer; and
a heatsink over the first die and the second die, wherein the interposer or the heatsink, or the interposer and the heatsink, comprise:
a trench, wherein the trench is vertically overlapping with a space between a first edge of the first die and a second edge of the second die, the space having a lateral width greater than a lateral width of the trench.
24. The electronic system of claim 23 , wherein the heatsink is an integrated heat spreader.
25. The electronic system of claim 23 , wherein the interposer is embedded in the package substrate.