Patent Assignment
Reel/Frame 052637/0872
Assignment of Assignor's Interest
Recorded: 2020-05-12
Pages: 3
Assignor
IMAYOSHI, KOJI
Executed: 2020-04-01
Assignee
TOPPAN PRINTING CO.,LTD.
5-1, TAITO 1-CHOME, TAITO-KU, TOKYO, 110-8560, JAPAN
Covered Property
(1)
Wiring Board, Semiconductor Device, and Method of Manufacturing Wiring Board