IP Library › Assignment 052654/0128
Patent Assignment
Reel/Frame 052654/0128

Assignment of Assignor's Interest

Recorded: 2020-05-13 Pages: 8
Assignors
BOO, KELVIN TAN AIK
Executed: 2020-04-15
CHONG, CHIN HUI
Executed: 2020-04-15
YE, SENG KIM
Executed: 2020-04-15
NG, HONG-YAN
Executed: 2020-04-15
TAKIAR, HEM P.
Executed: 2020-05-12
Assignee
MICRON TECHNOLOGY, INC.
8000 FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property (1)
Integrated Circuit Wire Bonded to a Multi-Layer Substrate Having an Open Area That Exposes Wire Bond Pads at a Surface of the Inner Layer
Application: 15/931,388 →
Publication: US 2021/0358888
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Spelling of the Fourth Named Inventor Previously Recorded at Reel: 052654 Frame: 0128. Assignor(S) Hereby Confirms the Assignment. May 22, 2020
From: BOO, KELVIN TAN AIK; CHONG, CHIN HUI; YE, SENG KIM; NG, HONG WAN
To: MICRON TECHNOLOGY, INC.
Reel/Frame 052741/0675 →