Patent Assignment
Reel/Frame 052741/0675
Corrective Assignment to Correct the Spelling of the Fourth Named Inventor Previously Recorded at Reel: 052654 Frame: 0128. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2020-05-22
Pages: 9
Assignors
BOO, KELVIN TAN AIK
Executed: 2020-04-15
CHONG, CHIN HUI
Executed: 2020-04-15
YE, SENG KIM
Executed: 2020-04-15
NG, HONG WAN
Executed: 2020-04-15
TAKIAR, HEM P
Executed: 2020-05-12
Assignee
MICRON TECHNOLOGY, INC.
8000 FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property
(1)
Integrated Circuit Wire Bonded to a Multi-Layer Substrate Having an Open Area That Exposes Wire Bond Pads at a Surface of the Inner Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.