Patent Assignment
Reel/Frame 052656/0634
Assignment of Assignor's Interest
Recorded: 2020-05-14
Pages: 4
Assignor
HSIEH, MENG-WEI
Executed: 2020-02-17
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same