Patent Assignment
Reel/Frame 052657/0329
Assignment of Assignor's Interest
Recorded: 2020-05-13
Pages: 5
Assignors
PARK, JIN SOO
Executed: 2020-04-23
PARK, MYUNG JUN
Executed: 2020-04-23
GU, HYUN HEE
Executed: 2020-04-23
KIM, BUM SOO
Executed: 2020-04-23
KANG, YEON SONG
Executed: 2020-04-23
CHUN, DUK HYUN
Executed: 2020-04-23
LEE, CHUNG EUN
Executed: 2020-04-23
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component and Manufacturing Method Thereof