Multilayer electronic component and manufacturing method thereof

1. A multilayer electronic component comprising: a body including a dielectric layer, and a first internal electrode and a second internal electrode alternately disposed in a first direction with the dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction; and

a first external electrode including a first electrode layer disposed on one of the third and fourth surfaces, a second electrode layer disposed on the first electrode layer, a third electrode layer disposed on the first and second surfaces, and a fourth electrode layer disposed on the second electrode layer and extending onto a portion of the third electrode layer,

wherein the fourth electrode layer includes a conductive metal and glass, and is in direct contact with the second electrode layer and the third electrode layer, and

among the first surface, the second surface, and the one of the third and fourth surfaces, the third electrode layer is disposed on only the first surface and the second surface.

2. The multilayer electronic component according to claim 1 , wherein the first electrode layer comprises the same metal as the first internal electrode, and the second electrode layer comprises the same metal as the fourth electrode layer.

3. The multilayer electronic component according to claim 1 , wherein the first internal electrode and the first electrode layer comprise Ni, and the second electrode layer and the fourth electrode layer comprise Cu.

4. The multilayer electronic component according to claim 1 , wherein the first external electrode further comprises one or more additional electrode layers disposed between the second electrode layer and the fourth electrode layer.

5. The multilayer electronic component according to claim 1 , wherein the first and second electrode layers are sintered electrodes formed by a transfer process, and the third and fourth electrode layers are sintered electrodes formed by a dipping process.

6. The multilayer electronic component according to claim 1 , wherein, a region of the first external electrode disposed on the one of the third and fourth surfaces is defined as a connection portion, a region of the first external electrode disposed on the first and second surfaces is defined as a band portion, a region of the first external electrode between the first connection portion and the first band portion is defined as a corner portion, and a thickness of the corner portion is 2.25 μm or more.

7. The multilayer electronic component according to claim 6 , wherein, the thickness of the corner portion is defined as D 1 , a thickness of the connection portion in a central portion of the body in the first direction is defined as D 2 , and D 1 /D 2 is 0.17 or more.

8. A multilayer electronic component comprising:

a body including a dielectric layer, and a first internal electrode and a second internal electrode alternately disposed in a first direction with the dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction; and

a first external electrode including a first electrode layer disposed on one of the third and fourth surfaces, a second electrode layer disposed on the first electrode layer, a third electrode layer disposed on the first and second surfaces, and a fourth electrode layer disposed on the second electrode layer and extending onto a portion of the third electrode layer,

wherein the fourth electrode layer includes a conductive metal and glass, and is in direct contact with the second electrode layer and the third electrode layer, and

thicknesses of the first and second electrode layers in a central portion of the body in the first direction are defined as Ta 1 and Tb 1 , respectively, thicknesses of the first and second electrode layers, at a point at which an internal electrode disposed at an outermost side in the first direction is located, among the first and second internal electrodes, are defined as Ta 2 and Tb 2 , respectively, Ta 2 /Ta 1 is 0.9 to 1.1, and Tb 2 /Tb 1 is 0.9 to 1.1.

9. The multilayer electronic component according to claim 8 , wherein the Ta 1 , Ta 2 , Tb 1 , and Tb 2 satisfy 0.9≤(Ta 1 +Tb 1 )/(Ta 2 +Tb 2 )≤1.1.

10. The multilayer electronic component according to claim 8 , wherein the sum of Ta 2 and Tb 2 is 12 to 18 μm.

11. The multilayer electronic component according to claim 1 , wherein a thickness of the third electrode layer is 8 to 11 μm.

12. The multilayer electronic component according to claim 1 , wherein the first external electrode further comprises a plating layer disposed on a portion of the third electrode layer that is exposed from the fourth electrode layer, and disposed on the fourth electrode layer.

13. The multilayer electronic component according to claim 1 , further comprising a second external electrode including a fifth electrode layer disposed on another of the third and fourth surfaces, a sixth electrode layer disposed on the fifth electrode layer, a seventh electrode layer disposed on the first and second surfaces, and an eighth electrode layer disposed on the sixth electrode layer and extending onto a portion of the seventh electrode layer.

14. A multilayer electronic component comprising:

a body including a dielectric layer, and a first internal electrode and a second internal electrode alternately disposed in a first direction with the dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction; and

a first external electrode including a first electrode layer disposed on one of the third and fourth surfaces, a second electrode layer disposed on the first electrode layer, a third electrode layer disposed on the first and second surfaces, and a fourth electrode layer disposed on the second electrode layer and extending onto a portion of the third electrode layer,

wherein the fourth electrode layer includes a conductive metal and glass, and is in direct contact with the second electrode layer and the third electrode layer, and

among the first surface, the second surface, and the one of the third and fourth surfaces, each of the first and second electrode layers is disposed on only the one of the third and fourth surfaces.

15. The multilayer electronic component according to claim 1 , wherein the fourth electrode layer is a sintered electrode.

16. A multilayer electronic component comprising:

a body including a dielectric layer, and a first internal electrode and a second internal electrode alternately disposed in a first direction with the dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction; and

a first external electrode including a first electrode layer disposed on one of the third and fourth surfaces, a second electrode layer disposed on the first electrode layer, a third electrode layer disposed on the first and second surfaces, and a fourth electrode layer disposed on the second electrode layer and extending onto a portion of the third electrode layer,

wherein the first external electrode further comprises a plating layer disposed on the fourth electrode layer and directly on a portion of the third electrode layer.

17. The multilayer electronic component according to claim 16 , wherein the first electrode layer comprises the same metal as the first internal electrode, and the second electrode layer comprises the same metal as the fourth electrode layer.

18. A multilayer electronic component comprising:

a body including a dielectric layer, and a first internal electrode and a second internal electrode alternately disposed in a first direction with the dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction; and

a first external electrode including a first electrode layer disposed on one of the third and fourth surfaces, a second electrode layer disposed on the first electrode layer, a third electrode layer disposed on the first and second surfaces, and a fourth electrode layer disposed on the second electrode layer and extending onto a portion of the third electrode layer,

wherein, among the first surface, the second surface, and the one of the third and fourth surfaces, the third electrode layer is disposed on only the first and second surfaces,

the third electrode covers an end of one or more of the first and second electrode layers in the first direction,

the second electrode layer extends from the end of the first electrode layer to another end of the first electrode layer in the first direction,

among the first surface, the second surface, and the one of the third and fourth surfaces, the second electrode layer is disposed on only the one of the third and fourth surfaces.

19. The multilayer electronic component according to claim 18 , wherein the first electrode layer comprises the same metal as the first internal electrode, and the second electrode layer comprises the same metal as the fourth electrode layer.

20. The multilayer electronic component according to claim 18 , wherein the first internal electrode and the first electrode layer comprise Ni, and the second electrode layer and the fourth electrode layer comprise Cu.