Patent Assignment
Reel/Frame 052694/0636
Assignment of Assignor's Interest
Recorded: 2020-05-18
Pages: 6
Assignors
LI, ERIC J.
Executed: 2017-01-20
MEHTA, VIPAL V.
Executed: 2017-01-20
RAORANE, DIGVIJAY A.
Executed: 2017-01-20
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Electronic Package Assembly with Compact Die Placement
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.