Patent Assignment
Reel/Frame 052696/0266
Assignment of Assignor's Interest
Recorded: 2020-05-19
Pages: 8
Assignors
CHUANG, HARRY-HAK-LAY
Executed: 2020-05-11
WU, WEI CHENG
Executed: 2020-05-06
TENG, LI-FENG
Executed: 2020-05-05
LIU, LI-JUNG
Executed: 2020-05-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method to Embed Planar Fets with Finfets