Patent Assignment
Reel/Frame 052697/0428
Assignment of Assignor's Interest
Recorded: 2020-05-19
Pages: 6
Assignors
OHTOU, TETSU
Executed: 2018-08-20
TSAI, CHING-WEI
Executed: 2018-07-17
CHENG, KUAN-LUN
Executed: 2018-07-10
OKUNO, YASUTOSHI
Executed: 2018-07-19
HUANG, JIUN-JIA
Executed: 2018-07-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof