Patent Assignment
Reel/Frame 052710/0451
Assignment of Assignor's Interest
Recorded: 2020-05-20
Pages: 4
Assignor
HONG, MINGI
Executed: 2020-04-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having Package-on-Package (Pop) Structures