Patent Assignment
Reel/Frame 052717/0748
Assignment of Assignor's Interest
Recorded: 2020-05-20
Pages: 3
Assignors
CHEN, WEI
Executed: 2020-05-15
ZHAI, JUN
Executed: 2020-05-20
HU, KUNZHONG
Executed: 2020-05-15
Assignee
APPLE INC.
ONE APPLE PARK WAY, CUPERTINO, CALIFORNIA, 95014
Covered Property
(1)
Electronic Package Including a Hybrid Thermal Interface Material and Low Temperature Solder Patterns to Improve Package Warpage and Reliability