Electronic package including a hybrid thermal interface material and low temperature solder patterns to improve package warpage and reliability
Electronic packages and modules are described. In an embodiment, a hybrid thermal interface material including materials with different thermal conductivities is used to attach a lid to a device. In an embodiment, a low temperature solder material is included as part of an adhesion layer for attachment with a stiffener structure.
1. An electronic package comprising:
a package substrate including a first side and a second side and routing within the package substrate;
a plurality of solder bumps on the second side of the package substrate, the plurality of solder bumps characterized by a reflow temperature of at least 200° C.;
a device mounted on the first side of the package substrate and connected with the routing;
a lid mounted on the first side of the package substrate and spanning over the device;
a hybrid thermal interface material (TIM) pattern connecting a top side of the device to an underside of the lid, wherein the hybrid TIM pattern includes a first TIM pattern of a first TIM and a second TIM pattern of a second TIM, the first TIM characterized by a higher thermal conductivity than the second TIM; and
a stiffener structure attached to the first side of the package substrate with a first solder material layer characterized by a melting temperature below 160° C. and a Young's modulus that is at least two orders of magnitude lower at the reflow temperature of the plurality of solder bumps than at 25° C.;
wherein a first portion of the stiffener structure is attached to the package substrate with a first adhesive material layer that is non-reflowable at 250° C. and a second portion of the stiffener structure is attached to the package substrate with the first solder material layer.
2. The electronic package of claim 1 , wherein the second TIM is characterized by a higher Young's modulus than the first TIM.
3. The electronic package of claim 2 , wherein the second TIM pattern is around a perimeter of the first TIM pattern.
4. The electronic package of claim 2 , wherein the second TIM pattern is located nearer lateral edges of the device than the first TIM pattern.
5. The electronic package of claim 2 , wherein the device includes a high performance logic region and an in/out (I/O) region, and the first TIM pattern is located directly over a larger area of the high performance logic region than the second TIM pattern is.
6. The electronic package of claim 5 , wherein the second TIM pattern is located directly over a larger area of the I/O region than the first TIM pattern is.
7. The electronic package of claim 1 , wherein the lid spans over and is attached to the stiffener structure, and the lid is attached to the stiffener structure with a second solder material layer characterized by a melting temperature below 160° C. and a Young's modulus that is at least two orders of magnitude lower at 250° C. than at 25° C.
8. The electronic package of claim 7 , wherein a first portion of the lid is attached to the stiffener structure with a second adhesive material layer that is non-reflowable at 250° C. and a second portion of the lid is attached to the stiffener structure with the second solder material layer.
9. An electronic package comprising:
a package substrate including a first side and a second side and routing within the package substrate;
a plurality of solder bumps on the second side of the package substrate, the plurality of solder bumps characterized by a reflow temperature of at least 200° C.;
a device mounted on the first side of the package substrate and connected with the routing; and
a stiffener structure attached to the first side of the package substrate with a first solder material layer characterized by a melting temperature below 160° C. and a Young's modulus that is at least two orders of magnitude lower at the reflow temperature of the plurality of solder bumps than at 25° C.;
wherein a first portion of the stiffener structure is attached to the package substrate with a first adhesive material layer that is non-reflowable at 250° C. and a second portion of the stiffener structure is attached to the package substrate with the first solder material layer.
10. The electronic package of claim 9 , further comprising a lid that spans over and is attached to the stiffener structure with a first adhesion layer material characterized by a Young's modulus that is at least two orders of magnitude lower at 250° C. than at 25° C.
11. The electronic package of claim 10 , wherein the first adhesion layer material is reflowable at 250° C. and non-reflowable at 25° C.
12. The electronic package of claim 11 , wherein the first adhesion layer material is a second solder material layer characterized by a melting temperature below 160° C.
13. The electronic package of claim 12 , wherein a first portion of the lid is attached to the stiffener structure with a second adhesive material layer that is non-reflowable at 250° C. and a second portion of the lid is attached to the stiffener structure with the second solder material layer.
14. An electronic package comprising:
a package substrate including a first side and a second side and routing within the package substrate;
a plurality of solder bumps on the second side of the package substrate, the plurality of solder bumps characterized by a reflow temperature of at least 200° C.;
a device mounted on the first side of the package substrate and connected with the routing;
a stiffener structure attached to the first side of the package substrate; and
a lid that spans over and is attached to the stiffener structure;
wherein a first portion of the lid is attached to the stiffener structure with an adhesive material layer that is non-reflowable at 250° C. and a second portion of the lid is attached to the stiffener structure with a solder material layer characterized by a melting temperature below 160° C. and a Young's modulus that is at least two orders of magnitude lower at the reflow temperature of the plurality of solder bumps than at 25° C.
15. A module comprising:
a circuit board; and
a package mounted on the circuit board with a plurality of solder bumps characterized by a reflow temperature of at least 200° C., the package comprising:
a package substrate including a first side and a second side and routing within the package substrate, the second side bonded to the circuit board with the plurality of solder bumps;
a device mounted on the first side of the package substrate and connected with the routing;
a lid mounted on the package substrate and spanning over the device;
a hybrid thermal interface material (TIM) pattern connecting a top side of the device to an underside of the lid, wherein the hybrid TIM pattern includes a first TIM pattern of a first TIM and a second TIM pattern of a second TIM, the first TIM characterized by a higher thermal conductivity than the second TIM; and
a stiffener structure attached to the first side of the package substrate with a first solder material layer characterized by a melting temperature below 160° C. and a Young's modulus that is at least two orders of magnitude lower at the reflow temperature of the plurality of solder bumps than at 25° C.;
wherein a first portion of the stiffener structure is attached to the package substrate with a first adhesive material layer that is non-reflowable at the reflow temperature of the plurality of solder bumps and a second portion of the stiffener structure is attached to the package substrate with the first solder material layer.
16. The module of claim 15 , wherein a first portion of the lid is attached to the stiffener structure with a second adhesive material layer that is non-reflowable at the reflow temperature of the plurality of solder bumps and a second portion of the lid is attached to the stiffener structure with a second solder material layer that is characterized by a melting temperature below 160° C. and a Young's modulus that is at least two orders of magnitude lower at the reflow temperature of the plurality of solder bumps than at 25° C.