IP Library › Assignment 052725/0316
Patent Assignment
Reel/Frame 052725/0316

Assignment of Assignor's Interest

Recorded: 2020-05-21 Pages: 4
Assignors
CHIU, YI-HSIANG
Executed: 2020-03-16
LEE, HUNG-PING
Executed: 2020-03-16
Assignee
J-METRICS TECHNOLOGY CO., LTD.
9F, NO. 102, SEC. 3, MINQUAN E. RD., SONGSHAN DIST.,, TAIPEI CITY, 105, TAIWAN
Covered Property (1)
Wafer Level Ultrasonic Device and Manufacturing Method Thereof
Application: 16/875,525 →
Publication: US 2021/0170448
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 10, 2023
From: J-METRICS TECHNOLOGY CO., LTD.
To: SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., LTD.
Reel/Frame 063600/0451 →