IP Library › Assignment 063600/0451
Patent Assignment
Reel/Frame 063600/0451

Assignment of Assignor's Interest

Recorded: 2023-05-10 Pages: 2
Assignor
J-METRICS TECHNOLOGY CO., LTD.
Executed: 2023-04-14
Assignee
SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., LTD.
ROOM 301, BUILDING 5, HANWEI IOT TECHNOLOGY INDUSTRIAL PARK, NO. 32 WUTONG STREET, ZHENGZHOU HI-TEK INDUSTRIAL DEVELOPMENT ZONE, ZHENGZHOU, HENAN PROVINCE, CHINA
Covered Property (1)
Wafer Level Ultrasonic Device and Manufacturing Method Thereof
Application: 16/875,525 →
Publication: US 2021/0170448
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 21, 2020
From: CHIU, YI-HSIANG; LEE, HUNG-PING
To: J-METRICS TECHNOLOGY CO., LTD.
Reel/Frame 052725/0316 →