Patent Assignment
Reel/Frame 052727/0299
Assignment of Assignor's Interest
Recorded: 2020-05-21
Pages: 2
Assignors
LIN, MING-HO
Executed: 2020-04-24
LIN, CHENG-I
Executed: 2020-04-24
CHEN, CHUN-HENG
Executed: 2020-04-28
CHUI, CHI ON
Executed: 2020-04-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Non-Conformal Capping Layer and Method Forming Same