Patent Assignment
Reel/Frame 052754/0293
Assignment of Assignor's Interest
Recorded: 2020-05-26
Pages: 3
Assignors
TSAI, JUNG-CHOU
Executed: 2020-02-18
CHANG, FONG-YUAN
Executed: 2020-02-18
HUANG, PO-HSIANG
Executed: 2020-02-18
LIU, CHIN-CHOU
Executed: 2020-02-18
CHENG, YI-KAN
Executed: 2020-02-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Interconnect Structure, Semiconductor Structure Including Interconnect Structure and Method for Forming the Same