Patent Assignment
Reel/Frame 052755/0227
Assignment of Assignor's Interest
Recorded: 2020-05-27
Pages: 5
Assignors
CHEN, CHIA-CHUNG
Executed: 2020-04-06
HUANG, CHI-FENG
Executed: 2020-04-23
LIANG, VICTOR CHIANG
Executed: 2020-04-23
CHU, CHUNG-HAO
Executed: 2020-04-13
YANG, CHING-YU
Executed: 2020-04-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Fabricating Semiconductor Device with Metal Pad Extending into Top Metal Layer