Patent Assignment
Reel/Frame 052761/0296
Assignment of Assignor's Interest
Recorded: 2020-05-27
Pages: 7
Assignors
YANG, SHIN-YI
Executed: 2020-04-08
LEE, MING-HAN
Executed: 2020-04-08
SHUE, SHAU-LIN
Executed: 2020-04-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Hybrid Interconnect Structure for Self Aligned Via