Patent Assignment
Reel/Frame 052764/0838
Assignment of Assignor's Interest
Recorded: 2020-05-27
Pages: 4
Assignors
TAI, CHIH-HSUAN
Executed: 2020-04-29
WENG, CHUNG-MING
Executed: 2020-05-08
KUO, HUNG-YI
Executed: 2020-05-08
HSIEH, CHENG-CHIEH
Executed: 2020-05-08
TSAI, HAO-YI
Executed: 2020-05-11
LIU, CHUNG-SHI
Executed: 2020-05-11
YU, CHEN-HUA
Executed: 2020-05-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package and Method of Forming Same