IP Library › Assignment 052769/0374
Patent Assignment
Reel/Frame 052769/0374

Assignment of Assignor's Interest

Recorded: 2020-05-28 Pages: 4
Assignors
TANAKA, YOSHINORI
Executed: 2020-05-28
CHANG, WEI-CHE
Executed: 2020-05-28
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK,, TAICHUNG CITY, TAIWAN
Covered Property (1)
Semiconductor Isolation Structures Having Different Configurations in Different Device Regions and Method of Forming the Same
Application: 16/885,286 →
Publication: US 2021/0376074