IP Library › Assignment 052794/0415
Patent Assignment
Reel/Frame 052794/0415

Assignment of Assignor's Interest

Recorded: 2020-05-29 Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2020-04-21
CHEN, MING-FA
Executed: 2020-04-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Structure Having Photonic Die and Electronic Die
Application: 16/885,242 →
Publication: US 2021/0375846