Patent Assignment
Reel/Frame 052796/0408
Assignment of Assignor's Interest
Recorded: 2020-06-01
Pages: 4
Assignors
CHEN, MING-FA
Executed: 2020-04-10
YEH, SUNG-FENG
Executed: 2020-04-10
LIU, TZUAN-HORNG
Executed: 2020-04-10
SHIH, CHAO-WEN
Executed: 2020-04-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Manufacturing the Same